Coaxial die and substrate bumps
US5347086A · kind A · utility
33Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 24, 1992 |
| Grant date | Sep 13, 1994 |
| Priority date | — |
| Expiry date | Mar 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A coaxial bump for connecting a die to a substrate includes a center post and a ground ring surrounding and shielding the center post. The center post may be a center conductor line, and the ground ring may be generally torus-shaped, nearly closed or completely closed. The coaxial bump provides very low crosstalk in chip-to-substrate interconnections and provides a constant impedance with negligible inductive discontinuity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.