High frequency signal transmission tape
US5349317A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 1993 |
| Grant date | Sep 20, 1994 |
| Priority date | — |
| Expiry date | Mar 31, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high frequency signal transmission tape for connecting a plurality of high frequency IC chips to each other or connecting a high frequency IC chip to a signal transmission line disposed on a package includes an insulating thin film having a surface; a conductive signal line disposed on the surface; and two conductive grounding lines disposed on the surface on opposite sides of, parallel to, and spaced from the signal line. The signal transmission tape produces small reflection and attenuation of signals in an extremely high frequency band, i.e., a millimeter-wave frequency band over 30 GHz. Therefore, high frequency IC chips arbitrarily arranged on a package are easily connected using the high frequency signal transmission tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.