Electrostatic apparatus and method for removing particles from semiconductor wafers
US5350428A · kind A · utility
24Cited by
12References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 1993 |
| Grant date | Sep 27, 1994 |
| Priority date | — |
| Expiry date | Jun 17, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is an apparatus and method for cleaning the edges of semiconductor wafers by using a particle removing means having an electrostatically charged material. The particles are collected and disposed of so that they do not come in contact again with the clean semiconductor wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.