Edge-mounted, surface-mount integrated circuit device
US5352851A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1992 |
| Grant date | Oct 4, 1994 |
| Priority date | — |
| Expiry date | Sep 8, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An edge-mounted integrated circuit device (10 ) includes a semiconductor die (11) and a lead frame (15) attached to the semiconductor die (11). The lead frame (15) includes a plurality of leads (14) electrically connected to the semiconductor die and lead frame supports (16, 18). A package (12) encapsulates the semiconductor die and a portion of the lead frame (15). The leads (14) extend from the package (12) and are bent to present a face for surface mount connection to conductors on a substrate. The supports (16, 18) extend from the package (12) for contacting the substrate to support the device (10) in position for soldering the leads (14) to conductors on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.