Apparatus for measuring heat of circuit module
US5356216A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | May 3, 1993 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | May 3, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K17/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatus for measuring the heat produced by a circuit module that is mounted on a circuit board has a tubular housing of a thermally resistive material such as plastic that is adapted to be placed over the module so that substantially all of the heat from the module flows along the axis of the housing, A thermal resistance is located between two metal partitions in the housing. The temperature drop through the resistance is calculated from the temperatures of the two partitions and the heat is calculated from the temperature drop and the value thermal resistance, The apparatus is adapted to make good thermal contact with the top of the module and cooling apparatus is provided for cooling the upper one of the two partitions. The upper partition is adjustable to vary the length of the thermal resistance in order to keep the temperature drop around 2.degree. C. for modules of different power ratings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.