Method for manufacture of printed circuit boards
US5358602A · kind A · utility
11Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 6, 1993 |
| Grant date | Oct 25, 1994 |
| Priority date | — |
| Expiry date | Dec 6, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for the manufacture of printed circuit boards is provided comprising conditioning the board, activating with a catalytic metal, post-activating, stabilizing and etching the copper surfaces before the desired circuit is formed on the board. This process eliminates the need for a flash coating of copper in the through holes before the use of protective coatings such as imaging resists and soldermasks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.