Method of Fabricating a micro-coaxial wiring structure
US5363550A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1992 |
| Grant date | Nov 15, 1994 |
| Priority date | — |
| Expiry date | Dec 23, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a micro-coaxial wiring structure comprises forming a first insulation layer and patterning a trench therein. A first conductive layer is formed on the first insulation layer and having a shape conforming to the insulation layer and lining the trench. A second insulation layer is formed on the first conductive layer within the trench and having a shape conforming to the first conductive layer lining the trench. A conductive signal line having a predetermined aspect ratio for providing a desired value of resistance per unit length is formed on the second insulation layer within the trench. A third insulation layer is then formed. Lastly, a conductive shielding line is formed upon the third insulation layer, the conductive shielding line being aligned with the conductive signal line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.