Molded plastic semiconductor package including an aluminum alloy heat spreader
US5367196A · kind A · utility
90Cited by
28References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1992 |
| Grant date | Nov 22, 1994 |
| Priority date | — |
| Expiry date | Sep 17, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a molded plastic electronic package having improved thermal dissipation. A heat spreader, formed from aluminum or an aluminum alloy, is partially encapsulated in the molding resin. Forming a black anodization layer on the surface of the heat spreader improves both thermal dissipation and adhesion to the molding resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.