Method and system for controlling plating bath parameters
US5368715A · kind A · utility
34Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1993 |
| Grant date | Nov 29, 1994 |
| Priority date | — |
| Expiry date | Feb 23, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is directed to an expert control system for controlling plating bath parameters. The system uses both feed-forward and feed-backward control to determine the amount and timing of replenisher additions of bath constituents to maintain optimum bath efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.