Binder resin for resin transfer molding preforms
US5369192A · kind A · utility
46Cited by
14References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1993 |
| Grant date | Nov 29, 1994 |
| Priority date | — |
| Expiry date | Jun 28, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/671
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a resin transfer molding preform binder resin that comprises at least one aromatic polyepoxide, a fluorene epoxide that is different than the aromatic polyepoxide and having a defined structure, and a 9,9-bis(aminophenyl)fluorene curing agent. The binder resin is a solid, room temperature stable, essentially nonsintering powder that displays a glass transition temperature greater than about 40.degree. C. Also disclosed are preforms made with the binder resin and a method for preparing the preforms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.