Electron beam exposure method and system for exposing a pattern on a substrate with an improved accuracy and throughput
US5369282A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1993 |
| Grant date | Nov 29, 1994 |
| Priority date | — |
| Expiry date | Jul 29, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31776
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electron beam exposure process includes a step of producing a plurality of electron beam elements from a single electron beam by shaping and radiating the plurality of electron beam elements on a substrate. The exposure is achieved in a plurality of times with respective electron beam patterns by means of different sets of electron beam elements, wherein the electron beam elements of different sets are produced simultaneously and deflected simultaneously so as to scan the substrate consecutively. The electron beam elements in one set are offset from corresponding electron beam elements of the other set by a pitch of M/N wherein N represents the number of the electron beam sets and M is an integer smaller than N.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.