Method of uniformly encapsulating a semiconductor device in resin
US5371044A · kind A · utility
50Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1992 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | Apr 30, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molding method in which a control plate having a size which is equal to or larger than the width of the outlet port of a supply passage are disposed in a cavity adjacent to the resin supply passage of a mold and thereby, the resin molding can be effected substantially equally at upper and lower sides of the insert comprising a semiconductor device and a lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.