Kenichi Imura
14Patents
7h-index
31Co-inventors
62Inventor score
Filing activity: Apr 30, 1992 → Dec 9, 2008
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5371044A | Method of uniformly encapsulating a semiconductor device in resin | Electricity | 50 | Expired |
| US6596561B2 | Method of manufacturing a semiconductor device using reinforcing patterns for ensuring mechanical strength during manufacture | Electricity | 33 | Expired |
| US7015069B2 | Method of manufacturing a semiconductor device and a semiconductor device | Electricity | 14 | Expired |
| US6723583B2 | Method of manufacturing a semiconductor device using a mold | Electricity | 13 | Expired |
| US6797542B2 | Fabrication method of semiconductor integrated circuit device | Electricity | 10 | Expired |
| US7322531B2 | Electronic device and method of manufacturing the same | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6872597B2 | Method of manufacturing a semiconductor device and a semiconductor device | Electricity | 7 | Expired |
| US7803660B2 | Method of manufacturing semiconductor device | Electricity | 5 | Active |
| US7295030B2 | Thin film transistor tester and corresponding test method | Physics | 4 | Expired |
| US7282943B2 | Inspection device for inspecting TFT | Electricity | 4 | Expired |
| US7467464B2 | Method of manufacturing a memory card | Emerging Cross-Sectional Technologies | 4 | Active |
| US7465609B2 | Method of manufacturing semiconductor device | Electricity | 1 | Active |
| US7086600B2 | Electronic device and method of manufacturing the same | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7144755B2 | Fabrication method of semiconductor integrated circuit device | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.