Chip interconnection having a breathable etch stop layer
US5371047A · kind A · utility
60Cited by
12References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1992 |
| Grant date | Dec 6, 1994 |
| Priority date | — |
| Expiry date | Oct 30, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S148/043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit having organic dielectric between interconnection layers eliminates damage caused by vapors outgassing from the organic dielectric by the use of a two-component organic layer having a breathable etch resistant organic layer above the main organic dielectric layer, both of the organic layers remaining in the final circuit. The etch resistant layer is resistant to the etchant used to pattern the layer of interconnect above the organic dielectric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.