Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate
US5374344A · kind A · utility
10Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1993 |
| Grant date | Dec 20, 1994 |
| Priority date | — |
| Expiry date | Jul 27, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a multi-compartment electroplating tank and a process for using the tank to simultaneously plate dissimilar materials onto a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.