Thomas P. Gall
26Patents
11h-index
45Co-inventors
75Inventor score
Filing activity: Oct 30, 1990 → May 24, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5137461A | Separable electrical connection technology | Emerging Cross-Sectional Technologies | 100 | Expired |
| US5185073A | Method of fabricating nendritic materials | Electricity | 86 | Expired |
| US6927344B1 | Flexible circuit board assembly | Emerging Cross-Sectional Technologies | 56 | Expired |
| US6483037B1 | Multilayer flexible FR4 circuit | Emerging Cross-Sectional Technologies | 55 | Expired |
| US5391514A | Low temperature ternary C4 flip chip bonding method | Electricity | 43 | Expired |
| US5734560A | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5679444A | Method for producing multi-layer circuit board and resulting article of manufacture | Emerging Cross-Sectional Technologies | 16 | Expired |
| US6501661B1 | Electronic control unit | Electricity | 16 | Expired |
| US5659951A | Method for making printed circuit board with flush surface lands | Emerging Cross-Sectional Technologies | 15 | Expired |
| US5359767A | Method of making multilayered circuit board | Emerging Cross-Sectional Technologies | 12 | Expired |
| US5403420A | Fabrication tool and method for parallel processor structure and package | Emerging Cross-Sectional Technologies | 11 | Expired |
| US5379193A | Parallel processor structure and package | Electricity | 10 | Expired |
| US5374344A | Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate | Electricity | 10 | Expired |
| US5709805A | Method for producing multi-layer circuit board and resulting article of manufacture | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5442144A | Multilayered circuit board | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5773195A | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7075794B2 | Electronic control unit | Electricity | 8 | Expired |
| US6098280A | Process for forming multi-layer electronic structures including a cap for providing a flat surface for DCA and solder ball attach and for sealing plated through holes | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5347710A | Parallel processor and method of fabrication | Emerging Cross-Sectional Technologies | 4 | Expired |
| US5363553A | Method of drilling vias and through holes | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7570492B2 | Apparatus for venting an electronic control module | Electricity | 4 | Expired |
| US8876122B2 | Level control for vehicles having at least one air spring | Performing Operations; Transporting | 3 | Active |
| US6594891B1 | Process for forming multi-layer electronic structures | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6749105B2 | Method and apparatus for securing a metallic substrate to a metallic housing | Performing Operations; Transporting | 0 | Expired |
| US7300820B2 | Adhesive assembly for a circuit board | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.