Patent · US Expired

Lightly-doped drain MOSFET with improved breakdown characteristics

US5374843A · kind A · utility

63Cited by
20References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 31, 1993
Grant dateDec 20, 1994
Priority date
Expiry dateMar 31, 2013

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A high voltage integrated circuit (IC) has a passivation structure that shields the underlying circuit from the electrical effects of charge on the passivation structure. In one embodiment, the passivation structure comprises a silicon rich nitride layer in electrical contact with underlying circuit elements. The silicon rich nitride is highly resistive and permits only a negligible current between elements, but is conductive enough that charge on the surface of the passivation structure flows into the IC before the electric fields in the underlying circuit elements is significantly changed. In another embodiment, the passivation structure has two or more layers with a less conductive layer in contact with the underlying IC and overlying conductive layer which shields the IC from the effects of charge build up.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.