Thermal micropump with values formed from silicon plates
US5375979A · kind A · utility
240Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 16, 1993 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Jun 16, 2013 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF04B19/24
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
In a micropump having a working chamber (1), an intake valve (2), and a discharge valve (3), the valves (2,3) are etched out of silicon wafers (4,5). The gas in the working chamber (1) is heated by a heating element (6), so that an overpressure is produced in the working chamber. A partial vacuum is created by cooling the gas in the working chamber (1). The pump action of the micropump is achieved through the succession of overpressure and partial-vacuum cycles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.