Direct metallization process
US5376248A · kind A · utility
11Cited by
7References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1991 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Oct 15, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0716
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A direct metallization process is disclosed wherein plastic substrates may be electrolytically plated without the need for any prior electroless plating. The process uses a specially formulated post-activator composition at an elevated temperature to treat the activated substrate comprising either an alkaline solution containing an effective amount of metal ions which undergo a disproportionation reaction or an alkaline solution containing a metal ion such as Cu.sup.+2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.