Highly heat-resistant positive resists comprising end-capped hydroxypolyamides

US5376499A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Albert Hammerschmidt · Erlangen, DE
• Siegfried Birkle · Höchstadt an der Aisch, DE
• Hellmut Ahne · Königsee, DE

Key dates

• Filing date: May 7, 1992
• Grant date: Dec 27, 1994
• Expiry date: May 7, 2012

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S430/107
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Cost-effective, highly heat-resistant positive resists based on oligomer and/or polymer polybenzoxazole precursors and diazo quinones possess a high [level of] stability in storage when the polybenzoxazole precursors are hydroxypolyamides of the following structure: ##STR1## whereby R, R*, R.sub.1, R*.sub.1, and R.sub.2 are aromatic groups, R.sub.3 is an aliphatic, cycloaliphatic or aromatic group having at least one alkenyl or alkynyl grouping and, with respect to n.sub.1, n.sub.2 and n.sub.3, the following applies: PA0 n.sub.1 =1 to 100, n.sub.3 and n.sub.3 =0 or PA0 n.sub.1 and n.sub.2 =1 to 100, n.sub.3 =0 or PA0 n.sub.2 =1 to 100, n.sub.1 and n.sub.3 =0 or PA0 n.sub.1, n.sub.2 and n.sub.3 =1 to 100 (whereby R.noteq.R* and/or R.noteq.R*.sub.1) or PA0 n.sub.1 and n.sub.3 =1 to 100, n.sub.2 =0 (whereby R.noteq.R* and/or R.sub.1 .noteq.R*.sub.1) , PA0 provided that: n.sub.1 +n.sub.2 +n.sub.3 >3.