Precursor composition capable of yielding a polyimidesilicone resin
US5376733A · kind A · utility
8Cited by
7References
10Claims
0Family size
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Key dates
| Filing date | Mar 23, 1994 |
| Grant date | Dec 27, 1994 |
| Priority date | — |
| Expiry date | Mar 23, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/455
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyimidesilicone resin precursor composition which comprises a polysiloxane of the following general formula ##STR1## wherein R is a monovalent organic group having up to 10 carbon atoms, R.sup.1 represents a hydrogen atom or a monovalent organic group having up to 10 carbon atoms, and m is an integer not smaller than 3, and a polyamic acid or a polyimide obtained from the polyamic acid. The composition is cured at a relatively low temperature within a short time to provide a cured film having improved solvent and heat resistances and good adhesion to various substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.