Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
US5378306A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 1994 |
| Grant date | Jan 3, 1995 |
| Priority date | — |
| Expiry date | Feb 7, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A rigid-flexible circuit board is fabricated by providing a core having a dielectric substrate and conductive layer thereon. A sub-composite comprising a polyimide and rigid dielectric substrate adjacent the conductive layer and in both the rigid and flexible segments of the board is provided. A release layer corresponding to the flexible segment of the board is provided. A rigid bonding layer is provided at rigid segments of the board but not at the flexible segments. A composite is formed by providing a second conductive layer adjacent the rigid bonding layer. The composite is laminated. Portions of the second conductive layer corresponding to the flexible segment and release layer are removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.