Thin-film wiring layout for a non-planar thin-film structure
US5378927A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 1993 |
| Grant date | Jan 3, 1995 |
| Priority date | — |
| Expiry date | May 24, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thin-film arrangement for a non-planar structure is described. The structure includes a substrate and a plurality of thin-film layers stacked on top of each other above the substrate. The layers contain conductive patterns and vias that provide connections between the conductive pattern in one of the layers to the conductive pattern in another layer. Vias that provide a connection between the conductive pattern of one layer to the conductive pattern in another remotely located layer are offset and in contact with respect to each other and are positioned in a non-linear arrangement, preferably in the form of a helix or a multiple helix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.