Keshav Prasad
9Patents
8h-index
27Co-inventors
61Inventor score
Filing activity: Aug 22, 1991 → Feb 14, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5756400A | Method and apparatus for cleaning by-products from plasma chamber surfaces | Emerging Cross-Sectional Technologies | 318 | Expired |
| US5209817A | Selective plating method for forming integral via and wiring layers | Electricity | 212 | Expired |
| US5757079A | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages and the resulting MLTF structure | Electricity | 53 | Expired |
| US5378927A | Thin-film wiring layout for a non-planar thin-film structure | Electricity | 27 | Expired |
| US5455387A | Semiconductor package with chip redistribution interposer | Electricity | 20 | Expired |
| US6444919B1 | Thin film wiring scheme utilizing inter-chip site surface wiring | Electricity | 16 | Expired |
| US5747095A | Method for repairing defective electrical connections on multi-layer thin film (MLTF) electronic packages | Electricity | 15 | Expired |
| US5464682A | Minimal capture pads applied to ceramic vias in ceramic substrates | Emerging Cross-Sectional Technologies | 9 | Expired |
| US5916451A | Minimal capture pads applied to ceramic vias in ceramic substrates | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.