Patent · US Expired

Leadless surface mountable assembly

US5379185A · kind A · utility

19Cited by

4References

19Claims

0Family size

Assignee

Motorola, Inc. · US

Inventors

Curtis M. Griffin · Boca Raton, US
John Robert Siomkos · Royal Palm Beach, US
Geroncio O. Tan · Austin, US

Key dates

Filing date	Nov 1, 1993
Grant date	Jan 3, 1995
Priority date	—
Expiry date	Nov 1, 2013

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A leadless surface mountable assembly (100) includes a heat dissipating cover (110), a substrate (120), a heat generating semiconductor device (130), and a spacer (140). The substrate (120) is mounted on the interior surface (115) of the cover (110). The heat generating semiconductor device (130) is thermally coupled to the cover (110) and electrically coupled to the substrate (120). The spacer (140) has an interface portion (147) which provides an electrical interface to the substrate (120). Electrical contacts (144) are disposed on the interface portion (147) of the spacer (140) and are electrically coupled to the substrate (120) through electrical conductors (145) within the spacer (140).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.