Encapsulated electronic component having a heat diffusing layer
US5379186A · kind A · utility
73Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1993 |
| Grant date | Jan 3, 1995 |
| Priority date | — |
| Expiry date | Jul 6, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1322
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.