Glenn E. Gold
4Patents
4h-index
7Co-inventors
36Inventor score
Filing activity: Jun 30, 1992 → Oct 11, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5696666A | Low profile exposed die chip carrier package | Electricity | 266 | Expired |
| US5313365A | Encapsulated electronic package | Electricity | 74 | Expired |
| US5379186A | Encapsulated electronic component having a heat diffusing layer | Electricity | 73 | Expired |
| US6242802A | Moisture enhanced ball grid array package | Electricity | 56 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.