Packaged integrated circuit including heat slug having an exposed surface
US5381042A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1994 |
| Grant date | Jan 10, 1995 |
| Priority date | — |
| Expiry date | Apr 19, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A low cost electronic device package having greatly improved heat dissipation capability. The package includes a heat slug, preferably formed from oxygen-free high-conductivity copper, that has a surface exposed outside the package. A simplified and inexpensive manufacturing method is described using a "drop in" technique. Using this technique, the size and shape of the heat slug is dependent only on the size and shape of the mold cavity; the package may have any number of leads and any size die. The heat slug is preferably formed with fins around its circumference so that the slug is self-aligning when it is dropped into the mold cavity. Preferably, slots are formed through the heat slug to provide improved encapsulant flow during the encapsulation process and interlocking between slug and encapsulant in the finished package. The heat slug may have at least one toughened surface on its circumference that interlocks with the encapsulant, helping to hold the heat slug in place and preventing contaminants from migrating to the interior of the package. Formation of encapsulant bleed or flash on the exposed heat slug surface are prevented by providing a dimensional mismatch between the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.