Amkor Electronics, Inc.
40Patents
0Active
40Granted
37Portfolio score
Filing activity: Dec 18, 1990 → Oct 16, 1997
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5355283A | Ball grid array with via interconnection | Emerging Cross-Sectional Technologies | 452 | Expired |
| US5701034A | Packaged semiconductor die including heat sink with locking feature | Emerging Cross-Sectional Technologies | 286 | Expired |
| US5723899A | Semiconductor lead frame having connection bar and guide rings | Electricity | 220 | Expired |
| US5381042A | Packaged integrated circuit including heat slug having an exposed surface | Electricity | 215 | Expired |
| US5583378A | Ball grid array integrated circuit package with thermal conductor | Electricity | 197 | Expired |
| US5478007A | Method for interconnection of integrated circuit chip and substrate | Emerging Cross-Sectional Technologies | 131 | Expired |
| US5915169A | Semiconductor chip scale package and method of producing such | Electricity | 130 | Expired |
| US5485037A | Semiconductor device having a thermal dissipator and electromagnetic shielding | Emerging Cross-Sectional Technologies | 100 | Expired |
| US5767446A | Printed circuit board having epoxy barrier around a throughout slot and ball grid array semiconductor package | Electricity | 96 | Expired |
| US5650593A | Thermally enhanced chip carrier package | Electricity | 82 | Expired |
| US5740956A | Bonding method for semiconductor chips | Electricity | 78 | Expired |
| US5641946A | Method and circuit board structure for leveling solder balls in ball grid array semiconductor packages | Emerging Cross-Sectional Technologies | 76 | Expired |
| US5829988A | Socket assembly for integrated circuit chip carrier package | Electricity | 76 | Expired |
| US5635671A | Mold runner removal from a substrate-based packaged electronic device | Electricity | 68 | Expired |
| US5708567A | Ball grid array semiconductor package with ring-type heat sink | Electricity | 64 | Expired |
| US5838951A | Wafer map conversion method | Electricity | 59 | Expired |
| US5482898A | Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding | Emerging Cross-Sectional Technologies | 46 | Expired |
| US5729432A | Ball grid array semiconductor package with improved heat dissipation and dehumidification effect | Electricity | 42 | Expired |
| US5328870A | Method for forming plastic molded package with heat sink for integrated circuit devices | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5854741A | Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5482736A | Method for applying flux to ball grid array package | Electricity | 38 | Expired |
| US5455462A | Plastic molded package with heat sink for integrated circuit devices | Emerging Cross-Sectional Technologies | 38 | Expired |
| US5807768A | Method for fabricating a heat sink-integrated semiconductor package | Electricity | 35 | Expired |
| US5661338A | Chip mounting plate construction of lead frame for semiconductor package | Electricity | 34 | Expired |
| US5483100A | Integrated circuit package with via interconnections formed in a substrate | Electricity | 34 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.