Method of stripping resists from substrates using hydroxylamine and alkanolamine
US5381807A · kind A · utility
51Cited by
2References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 28, 1993 |
| Grant date | Jan 17, 1995 |
| Priority date | — |
| Expiry date | Oct 28, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02052
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A stripping composition for removing resists from substrates containing hydroxylamine and at least one alkanolamine is described. Optionally, one or more polar solvents can also be included in the stripping composition. The stripping composition is especially suitable for removing a photoresist from a substrate during the manufacture of semiconductor integrated circuits and for removing cured polymer coatings, such as polyimide coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.