Alkali-developable positive-working photosensitive resin composition
US5384228A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1993 |
| Grant date | Jan 24, 1995 |
| Priority date | — |
| Expiry date | Oct 8, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C309/76
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A novel alkali-developable photosensitive resin composition, which is suitable for use as a photoresist composition for fine patterning in the manufacture of various electronic devices, is proposed. The photosensitive resin composition comprises, as the essential ingredients, (a) an alkali-soluble novolac resin as the film-forming ingredient and (b) a very specific compound which is a 1,2-quinone diazide sulfonic acid ester of a condensation product having a weight-average molecular weight of 400 to 2000 obtained by the condensation reaction between phenol and a hydroxybenzaldehyde in the presence of an acidic catalyst as the photosensitizing agent. By virtue of the formulation with this specific photosensitizer, the resist layer formed from the inventive composition has a greatly increased focusing latitude in addition to the excellent sensitivity, resolution and heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.