Photosensitive resin composition and semiconductor apparatus using it
US5385808A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1993 |
| Grant date | Jan 31, 1995 |
| Priority date | — |
| Expiry date | Oct 25, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a photosensitive resin composition which comprises as essential components: (A) a polyamic acid having a recurring unit represented by the following formula [I]: ##STR1## wherein 0.5-50 mol % of R.sub.1 consists of a silicone diamine residue represented by the following formula [II]: ##STR2## wherein n represents an integer of 1-50, and the remainder of 50-99.5 mol % of R.sub.1 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, and a heterocyclic group, and R.sub.2 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, a heterocyclic group, and a silicone group, and m represents 1 or 2, (B) an amide compound having carbon-carbon double bond, and (C) a photosensitizer. The present invention further provides a semiconductor apparatus in which the above composition is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.