Snap on heat sink attachment
US5386144A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1993 |
| Grant date | Jan 31, 1995 |
| Priority date | — |
| Expiry date | Jun 18, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink (44-48) is detachably mechanically connected to an electronic component package (10) by means of a pair of mutually spaced and parallel spring rods (16, 18) that are fixed to the electronic component package and span a recess (14) formed in a surface of the package. The heat sink is formed with a projecting latching member (50) having a short shank (52) on the end of which is formed a laterally outwardly extending flange (60). The flange has shoulders (62) that slope outwardly and away from the heat sink body and distal ends on which are formed cam surfaces (66) that slope inwardly away from the heat sink body. The latching member (50) of the heat sink is pressed into the electronic component package recess between the resilient rods (16, 18) to force the rods apart and to pass the outer most ends (64) of the flange this causes the rods to contact the flange shoulders (62) in a slightly outwardly bowed position of the rods. The resilience of the rods accordingly tends to exert a constant force on the latching member flange tending to pull the heat sink against the electronic component package. Thus, the heat sink may be snapped into a latching engagement with the compon…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.