Patrick Variot
32Patents
15h-index
9Co-inventors
74Inventor score
Filing activity: Jun 18, 1993 → May 23, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5435482A | Integrated circuit having a coplanar solder ball contact array | Emerging Cross-Sectional Technologies | 115 | Expired |
| US5557150A | Overmolded semiconductor package | Electricity | 68 | Expired |
| US5692296A | Method for encapsulating an integrated circuit package | Emerging Cross-Sectional Technologies | 55 | Expired |
| US5745986A | Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage | Emerging Cross-Sectional Technologies | 46 | Expired |
| US5570272A | Apparatus for encapsulating an integrated circuit package | Emerging Cross-Sectional Technologies | 45 | Expired |
| US5527743A | Method for encapsulating an integrated circuit package | Emerging Cross-Sectional Technologies | 42 | Expired |
| US5989937A | Method for compensating for bottom warpage of a BGA integrated circuit | Emerging Cross-Sectional Technologies | 29 | Expired |
| US5563446A | Surface mount peripheral leaded and ball grid array package | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6117695A | Apparatus and method for testing a flip chip integrated circuit package adhesive layer | Electricity | 26 | Expired |
| US5869889A | Thin power tape ball grid array package | Electricity | 25 | Expired |
| US5841198A | Ball grid array package employing solid core solder balls | Emerging Cross-Sectional Technologies | 24 | Expired |
| US6088914A | Method for planarizing an array of solder balls | Emerging Cross-Sectional Technologies | 24 | Expired |
| US5420752A | GPT system for encapsulating an integrated circuit package | Emerging Cross-Sectional Technologies | 20 | Expired |
| US6054767A | Programmable substrate for array-type packages | Electricity | 20 | Expired |
| US5933710A | Method of providing electrical connection between an integrated circuit die and a printed circuit board | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5386144A | Snap on heat sink attachment | Electricity | 11 | Expired |
| US6297550A | Bondable anodized aluminum heatspreader for semiconductor packages | Electricity | 9 | Expired |
| US5789811A | Surface mount peripheral leaded and ball grid array package | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5981311A | Process for using a removeable plating bus layer for high density substrates | Electricity | 4 | Expired |
| US5901437A | Method for planarizing an array of solder balls | General | 3 | Revoked |
| US6110815A | Electroplating fixture for high density substrates | Electricity | 3 | Expired |
| US10181447B2 | 3D-interconnect | Electricity | 2 | Active |
| US11031362B2 | 3D-interconnect | Electricity | 2 | Active |
| US6492253B1 | Method for programming a substrate for array-type packages | Electricity | 2 | Expired |
| US6489571B1 | Molded tape ball grid array package | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.