Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same
US5387493A · kind A · utility
16Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1990 |
| Grant date | Feb 7, 1995 |
| Priority date | — |
| Expiry date | Oct 18, 2010 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09845
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.