Integrated circuit with supports for mounting an electrical component
US5387814A · kind A · utility
15Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1993 |
| Grant date | Feb 7, 1995 |
| Priority date | — |
| Expiry date | Jun 30, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A packaged integrated circuit device (2) has exposed contacts (8a, 8b) for electrical connection to terminals of an electrical component, such as a bypass capacitor (10), mounted externally from packaging material (4). The contacts (8a, 8b) are electrically connected to power and ground leads (6) extending from packaging material (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.