Semiconductor device having a flat jumper lead
US5389817A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 1993 |
| Grant date | Feb 14, 1995 |
| Priority date | — |
| Expiry date | Nov 29, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plastic package type semiconductor device comprises: a die pad consisting of a plurality of parts; a tab lead consisting of a plurality of parts holding the die pad; a flat type Jumper lead formed between the parts of the die pad; an electrical insulating type insulating film formed on the die pad; a semiconductor chip bonded on the insulating film by an adhesive; and a plastic mold as a plastic package for molding the die pad, the tab lead, the flat type Jumper lead, the insulating file, and the semiconductor device in the plastic mold, whereby the semiconductor chip is Insulated electrically from the die pad. In addition, a SOJ plastic package type semiconductor device has a configuration without the Jumper lead described above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.