Patent · US Expired

Expandable diaphragm test modules and connectors

US5389885A · kind A · utility

101Cited by
10References
13Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJan 26, 1993
Grant dateFeb 14, 1995
Priority date
Expiry dateJan 26, 2013

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01R2201/16
  • WIPO fieldElectrical machinery, apparatus, energy
  • WIPO sectorElectrical engineering

Abstract

A test module tests integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) by first placing the module over the package. Each module has rows of test probes for electrically contacting corresponding electrical leads on the IC package. Solid test probes are mounted in a housing in the test module so that electrical connection is achieved between the probes and a flexible printed circuit board that communicates electrical test signals from an external circuit test analyzer to the probes. A thin, flexible elastic diaphragm is mounted across the ends of the test probes so that the diaphragm is elastically movable away from the housing in response to axial pressure from the test probes being pressed against the leads of the IC package. The diaphragm stretches and thereby provides a spring force against the test probes. The test module is used in test fixtures by mounting the test modules in a probe plate spaced from IC packages to be tested. Other test probes, such as spring probes, are mounted in the probe plate in a pattern corresponding to other test points on the board under test. Another embodiment provides a connector interface in which a flexible diaphra…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.