Ionic modification of organic resins and photoresists to produce photoactive etch resistant compositions
US5393642A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 31, 1992 |
| Grant date | Feb 28, 1995 |
| Priority date | — |
| Expiry date | Dec 31, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/126
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photoresist composition is disclosed that comprises an organic resin that is thermoset by acid catalysis and a photoactive, etch-resistant ionic modifier formed of an anion and a cation. The modifier is present in the organic resin in an amount effective to produce substantial photoreactivity and etch resistance in a mixture of the resin and the modifier. The cation will, upon exposure to electromagnetic radiation, produce a species that is weakly basic or neutral, and the anion will, upon exposure to electromagnetic radiation, produce an acid precursor that will form a relatively strong acid in an acid-base solvent system. As a result, the relatively strong acid will catalyze the organic resin upon exposure to an appropriate frequency of electromagnetic radiation and the relatively weak base or neutral species formed by the cation will not substantially neutralize the acid or interfere with the acid catalyzed reaction of the organic resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.