Polishing machine and method of dissipating heat therefrom
US5400547A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1993 |
| Grant date | Mar 28, 1995 |
| Priority date | — |
| Expiry date | Feb 25, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B55/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing machine for polishing a flat workpiece such as a semiconductor wafer has a rotatable reference table supporting an abrasive cloth disposed on a surface thereof, and a rotatable workpiece holder for holding a flat workpiece against the abrasive cloth. While the flat workpiece is being polished by the abrasive cloth, an abrasive compound is supplied between the abrasive cloth and the flat workpiece. The reference table has grooves defined therein for dissipating heat from the reference table and the abrasive cloth while the flat workpiece is being polished by the abrasive cloth. The grooves may be supplied with either the abrasive compound or a coolant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.