Patent · US Expired

Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound

US5401605A · kind A · utility

5Cited by
7References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 29, 1994
Grant dateMar 28, 1995
Priority date
Expiry dateJul 29, 2014

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/022
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Proposed is a positive-working photosensitive resin composition suitable as a photoresist in the photolithographic patterning work for the manufacture of, for example, semiconductor devices having excellent storage stability and capable of giving a patterned resist layer having excellent contrast of the images, orthogonality of the cross sectional profile of line patterns and heat resistance along with a satisfactorily high photosensitivity and large focusing latitude. The composition comprises, in admixture with an alkali-soluble novolac resin as a film-forming agent, a photosensitizing agent which is an esterification product of a specific tris(hydroxyphenyl) methane compound of which two of the hydroxyphenyl groups each have a cyclohexyl group bonded thereto at a specified position with at least one naphthoquinone-1,2-diazide sulfonyl group as the esterifying group.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.