Metal foil for printed wiring board and production thereof
US5403672A · kind A · utility
17Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 1993 |
| Grant date | Apr 4, 1995 |
| Priority date | — |
| Expiry date | May 12, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12993
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.