Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
US5403869A · kind A · utility
8Cited by
10References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 1993 |
| Grant date | Apr 4, 1995 |
| Priority date | — |
| Expiry date | Aug 17, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.