Interconnect capacitors
US5404265A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1992 |
| Grant date | Apr 4, 1995 |
| Priority date | — |
| Expiry date | Aug 28, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A bypass capacitor for use with an integrated circuit module, and method of making the same, are shown. The integrated circuit module comprises an integrated circuit "chip" mounted in opposing relationship to a carrier substrate and having a plurality of interconnects, such as solder bumps or wire interconnects, for providing signal lines and supplying power to the chip. Some of the interconnects are, instead, used to form capacitors such that bypass capitance is placed in close proximity to the chip, while not using up valuable real estate on the chip or on the carrier substrate. Various embodiments of such bypass capacitors are shown.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.