Wen-chou Vincent Wang
59Patents
32h-index
32Co-inventors
84Inventor score
Filing activity: Aug 7, 1992 → May 12, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6343171B1 | Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making | Electricity | 241 | Expired |
| US5454161A | Through hole interconnect substrate fabrication process | Emerging Cross-Sectional Technologies | 211 | Expired |
| US6690845B1 | Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making | Electricity | 202 | Expired |
| US6684007B2 | Optical coupling structures and the fabrication processes | Electricity | 186 | Expired |
| US5854534A | Controlled impedence interposer substrate | Electricity | 176 | Expired |
| US6239485A | Reduced cross-talk noise high density signal interposer with power and ground wrap | Electricity | 152 | Expired |
| US6845184B1 | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making | Electricity | 143 | Expired |
| US5660957A | Electron-beam treatment procedure for patterned mask layers | Electricity | 131 | Expired |
| US6444921B1 | Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like | Electricity | 129 | Expired |
| US6050832A | Chip and board stress relief interposer | Electricity | 128 | Expired |
| US5514906A | Apparatus for cooling semiconductor chips in multichip modules | Electricity | 105 | Expired |
| US5426563A | Three-dimensional multichip module | Emerging Cross-Sectional Technologies | 97 | Expired |
| US6611635B1 | Opto-electronic substrates with electrical and optical interconnections and methods for making | Electricity | 94 | Expired |
| US5722162A | Fabrication procedure for a stable post | Emerging Cross-Sectional Technologies | 89 | Expired |
| US5474458A | Interconnect carriers having high-density vertical connectors and methods for making the same | Electricity | 86 | Expired |
| US6187652A | Method of fabrication of multiple-layer high density substrate | Electricity | 82 | Expired |
| US5419038A | Method for fabricating thin-film interconnector | Emerging Cross-Sectional Technologies | 80 | Expired |
| US6785447B2 | Single and multilayer waveguides and fabrication process | Electricity | 79 | Expired |
| US6706546B2 | Optical reflective structures and method for making | Electricity | 76 | Expired |
| US6669801B2 | Device transfer method | Emerging Cross-Sectional Technologies | 65 | Expired |
| US5655290A | Method for making a three-dimensional multichip module | Emerging Cross-Sectional Technologies | 64 | Expired |
| US5544017A | Multichip module substrate | Emerging Cross-Sectional Technologies | 63 | Expired |
| US6168972A | Flip chip pre-assembly underfill process | Electricity | 56 | Expired |
| US5404265A | Interconnect capacitors | Emerging Cross-Sectional Technologies | 52 | Expired |
| US6882045B2 | Multi-chip module and method for forming and method for deplating defective capacitors | Electricity | 47 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.