Laser interconnection of circuits on transparent substrate
US5407710A · kind A · utility
11Cited by
17References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1993 |
| Grant date | Apr 18, 1995 |
| Priority date | — |
| Expiry date | Aug 4, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/1309
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for the interconnection/repair of circuits on a transparent substrate at ambient temperature using laser induced chemical vapor deposition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.