Polymerizable compound, process for producing same and setting composition containing polymerizable compound
US5410069A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1992 |
| Grant date | Apr 25, 1995 |
| Priority date | — |
| Expiry date | Dec 8, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F22/40
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A polymerzable compound represented by the general formula (1) X--R.sub.1 --Y where X is un unsaturated imide group having substituents R.sub.2 and R.sub.3, or an itacon imide group where R.sub.2 and R.sub.3 are selected from the group consisting of hydrogen, a lower alkyl group and an aromatic group having a substituent p which is hydrogen, a lower alkyl group, or an alkoxy group, and Y is a styryl group, and R.sub.1 is a divalent organic group. The polymerizable compounds is excellent in formability, and find a wide variety of applications because they have functional groups different in reactivity from each other and hence allow the curing conditions to control. The cured polymers are excellent in thermal durability, mechanical properties and electrical properties, making it possible to achieve higher performance, higher reliability, highly compact and lower weight of electric apparatuses and electronic parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.