Inventor · Hitachi, JP

Satoru Amou

27Patents
5h-index
47Co-inventors
69Inventor score

Filing activity: Sep 13, 1989 → May 22, 2013

Most-cited inventions

PatentTitleAreaCited byStatus
US6190834A Photosensitive resin composition, and multilayer printed circuit board using the same Emerging Cross-Sectional Technologies 22 Expired
US8470723B2 Low softening point glass composition, bonding material using same and electronic parts Emerging Cross-Sectional Technologies 16 Active
US5914216A Multilayer circuit board and photosensitive resin composition used therefor Emerging Cross-Sectional Technologies 11 Expired
US7294905B2 Thin film capacitor and electronic circuit component Electricity 9 Expired
US7273900B2 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof Emerging Cross-Sectional Technologies 6 Expired
US7193009B2 Electronic device using low dielectric loss tangent insulators for high frequency signals Electricity 5 Expired
US8227361B2 Prepreg and printed wiring board using thin quartz glass cloth Emerging Cross-Sectional Technologies 5 Active
US6756441B2 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Electricity 5 Expired
US8115105B2 Prepreg and its application products for low thermal expansion and low dielectric tangent Emerging Cross-Sectional Technologies 4 Active
US5071824A Heat transfer sheet, method for producing it, and method of heat transfer Emerging Cross-Sectional Technologies 3 Expired
US5565536A Polymerizable compouund, process for producing same and setting composition containing polymerizable compound Chemistry; Metallurgy 3 Expired
US9034475B2 Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same Emerging Cross-Sectional Technologies 3 Active
US7638564B2 Low dielectric loss tangent-resin varnish, prepreg, laminated sheet, and printed wiring board using the varnish Emerging Cross-Sectional Technologies 2 Active
US8420210B2 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof Emerging Cross-Sectional Technologies 2 Active
US5410069A Polymerizable compound, process for producing same and setting composition containing polymerizable compound Chemistry; Metallurgy 2 Expired
US8685872B2 Low softening point glass composition, bonding material using same and electronic parts Emerging Cross-Sectional Technologies 2 Active
US6855952B2 Semiconductor device and semiconductor package Emerging Cross-Sectional Technologies 1 Expired
US9028970B2 Adhesive composition, varnish, adhesive film and wiring film Emerging Cross-Sectional Technologies 1 Active
US8097545B2 Phase-separation-controlled polybutadiene resin composition and printed wiring board using the resin composition Emerging Cross-Sectional Technologies 1 Active
US6930140B2 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Electricity 1 Expired
US8735724B2 Electric equipment having insulation structure at welding parts Electricity 1 Active
US7375155B2 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof Electricity 0 Expired
US8507592B2 Adhesive composition, adhesive film and wiring film using the same Emerging Cross-Sectional Technologies 0 Active
US9493605B2 Epoxy-vinyl copolymerization type liquid resin composition, cured product of the same, electronic/electric apparatus using the cured product, and method of producing the cured product Chemistry; Metallurgy 0 Active
US9090796B2 Organic-inorganic composite materials containing triazine rings and electrical devices using the same Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.