Patent · US Expired

Method of making high voltage transistor

US5411901A · kind A · utility

38Cited by
5References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 25, 1993
Grant dateMay 2, 1995
Priority date
Expiry dateOct 25, 2013

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D84/87

Abstract

In a method for constructing a semiconducting device, within a substrate of a first conductivity type there is formed a well of second conductivity type. Within the well, an extended drain region of a first conductivity type is formed. An insulating region over the extended drain region is formed. A gate region is formed on a surface of the substrate. A first side of the gate region is adjacent to a first end of the extended drain region. A drain region of the first conductivity type is formed. The drain region is in contact with a second end of the extended drain region. A source region is formed on a second side of the gate region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.