Low bromine-content materials for manufacturing printed circuit boards
US5414059A · kind A · utility
0Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1992 |
| Grant date | May 9, 1995 |
| Priority date | — |
| Expiry date | Jun 25, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/56
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resinous material for the manufacture of printed circuit boards is obtained by (a) treating a mixture of bromine- and nonbromine-containing epoxy resins with a secondary diamine such as 5,5-dimethyl hydantion or barbituric acid in the presence of a tertiary amine catalyst to form a modified epoxy resin; (b) heating the modified epoxy resin and a polyisocyanate in the presence of an encyclization catalyst; and (c) dissolving the resulting product in a solvent with a curing agent to form a B-stage prepreg varnish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.